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X-Sight 3D DIC System

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The X-Sight 3D DIC optical measuring system is versatile, complex, and easy to operate. X-Sight 3D is an adaptable system for sophisticated and varied stereoscopic strain analysis involving out-of-plane deformations and motion measurements. Its high accuracy and reliability guarantee robust data outputs for various applications, including high-speed imaging. The system can also be used as the most advanced customized optical extensometer.

With comprehensive post-processing analytic functionality, the system provides an effective way to validate FEM results, verify CAD models, and perform structural deformation analyses.

X-Sight 3D can be equipped with a large variety of cameras, lenses, lights, and further optical accessories.

Features

In-Plane subpixel resolution: 0.008%


Out-of-Plane subpixel resolution: 0.016%


Strain resolution 50 microstrains

- 10 microstrains with time averaging

- 5 microstrain in optical extensometer mode


Strain range from 0.005% to > 2000%


Measuring area (specimen size) range from 1 mm to 100 m

- <10 mm specimen must be measured with a special microscope

- 10 m specimen can only be calibrated using the LOCF (Large Object Calibration Fuction)


DIC of natural patterns, speckle patterns, image features and markers

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Portable DIC 3D Measurement Kit

Our DIC 3D system comes conveniently packaged in a practical carrying case, ensuring you have all you need for comprehensive measurement on the go. The complete kit includes:

 

2 × low-noise camera


calibration grids & speckle kit


camera mount


standard lenses of chosen focal length


battery LED lighting


transport box, cables and power sources


converter – 4-channel A/D, 2-channel D/A


USB license dongle with installation SW


installation assistance and training


24 hrs of engineering support over 12 months

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