X-Sight 3D DIC System
The X-Sight 3D DIC optical measuring system is versatile, complex, and easy to operate. X-Sight 3D is an adaptable system for sophisticated and varied stereoscopic strain analysis involving out-of-plane deformations and motion measurements. Its high accuracy and reliability guarantee robust data outputs for various applications, including high-speed imaging. The system can also be used as the most advanced customized optical extensometer.
With comprehensive post-processing analytic functionality, the system provides an effective way to validate FEM results, verify CAD models, and perform structural deformation analyses.
X-Sight 3D can be equipped with a large variety of cameras, lenses, lights, and further optical accessories.
Features
In-Plane subpixel resolution: 0.008%
Out-of-Plane subpixel resolution: 0.016%
Strain resolution 50 microstrains
- 10 microstrains with time averaging
- 5 microstrain in optical extensometer mode
Strain range from 0.005% to > 2000%
Measuring area (specimen size) range from 1 mm to 100 m
- <10 mm specimen must be measured with a special microscope
- 10 m specimen can only be calibrated using the LOCF (Large Object Calibration Fuction)
DIC of natural patterns, speckle patterns, image features and markers
Portable DIC 3D Measurement Kit
Our DIC 3D system comes conveniently packaged in a practical carrying case, ensuring you have all you need for comprehensive measurement on the go. The complete kit includes:
2 × low-noise camera
calibration grids & speckle kit
camera mount
standard lenses of chosen focal length
battery LED lighting
transport box, cables and power sources
converter – 4-channel A/D, 2-channel D/A
USB license dongle with installation SW
installation assistance and training
24 hrs of engineering support over 12 months